Pájecí materiály

Americká společnost Kester nabízí širokou škálu materiálů určených pro elektrotechnický průmysl.

Ve svém portfoliu jsou pájecí pasty, tyčový cín, pájecí dráty a tavidla.

Vše Pájecí pasty Tavidla Pájecí drát
 


NeVo

NeVo NeVo je dceřiná firma společnosti AMTECH. Zabývá se výrobou spotřebních materiálů do SMT průmyslu. Pro více informací prosím kontaktujte: Daniel Pospíšil (dp@nevo-solder.com / mob. : +420 776 120 528).

Více info  www

logonevo

186 Soldering Flux

186 Soldering Flux Kester 186, under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue after soldering is non-corrosive and non-conductive. 186 rosin flux has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. This flux possess high thermal stability for soldering multi-layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.

Specifikace (EN)  pdf

186

2235 Soldering Flux

2235 Soldering Flux Kester 2235 is a high activity 11% solids organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. 2235, a flux with comparably low solids in respect to other fluxes in the same category, will produce fewer skips on the bottom side surface mount pads. The residue after soldering is effectively removed in standard water cleaning systems. Although possessing high activity, boards exhibit high ionic cleanliness after water cleaning, exceeding the requirements of MIL-P-28809. No offensive odors or excessive smoke are emitted during soldering. The flux will not create excessive foaming in standard water cleaning systems.

Specifikace (EN)  pdf

2235

2331-ZX Soldering Flux

2331-ZX Soldering Flux Kester 2331-ZX is an innovation in organic acid water-soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic water-soluble flux available to the electronics industry. This popular flux has been used for soldering critical assemblies in the computer, telecommunications and other industries. No offensive odors will be emitted during soldering. 2331-ZX will not create excessive foaming in standard water cleaning systems. 2331-ZX has good soldering properties for improved productivity without sacrificing reliability of the assembly. This flux does not attack properly cured solder masks or FR-4 epoxy-glass laminate. 2331-ZX is not detrimental to the surface insulation resistance of the soldered assembly. Use of this flux minimizes cleaning costs while complying with environmental regulations.

Specifikace (EN)  pdf

2331-ZX

952-S Soldering Flux

952-S Soldering Flux Kester 952-S is a zero-halogen, non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) module industry by soldering tabs to cell contacts. 952-S could be applied directly to interconnecting ribbon by hand soldering or auto-equipment with tabber and stringer soldering system, by dipping or spraying. The extremely low solids content (around 2%) and nature of the activator system results in practically no residue left on the cell after soldering. Cell are dry and cosmetically clean as they exit the tabber and stringer machine. 952-S has a wider operating window varying with temperature range, and can be used in SnPb, SnAgPb and Pb-free alloys.

Specifikace (EN)  pdf

952-S

959T Soldering Flux

959T Soldering Flux Kester 959T is a no-clean, non-corrosive, liquid flux that is designed for the wave soldering of conventional and surface mount circuit board assemblies. 959T was developed to minimize the formation of micro-solderballs during wave soldering operations. This flux contains a small percentage of rosin (0.5%), which improves solderability, heat stability and surface insulation resistance. 959T offers the best wetting and the shiniest solder joints of any no-clean, solvent-based chemistry. 959T leaves evenly distributed residues for the best cosmetic appearance.

Specifikace (EN)  pdf

959T

979VT Soldering Flux

979VT Soldering Flux Kester 979VT is a VOC-free, no-clean flux formulation for high quality, low-defect soldering of lead-free electronic circuit board assemblies. This flux’s finely tuned activation system offers the best wetting available in VOC-free liquid flux technology and the shiniest solder joints. 979VT also reduces micro-solderballing on glossy and matte laminates and between connector pins. 979VT will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. It has been specially formulated to accommodate needs of single sided board assemblers. 979VT leaves no haze or visible residue behind, including the white powdery residue associated with use of earlier no-clean formulas. The miniscule amount of non-visible residue that remains after soldering is non-conductive, non-corrosive, and does not need to be removed.

Specifikace (EN)  pdf

979VT

985M Soldering Flux

985M Soldering Flux Kester 985M is a low solids, halide-free, no-clean flux that is designed for wave solder, selective solder and touch up processes. 985M was developed for use with both traditional tin-lead and lead-free solder alloys. 985M exhibits improved soldering performance to minimize solder bridges (shorts) during all soldering operations. This flux is suitable for automotive, computer, telecommunications and other applications where reliability considerations are critical. As tested under J-STD-004A specifications 985M is classified Type ROL0.

Specifikace (EN)  pdf

985M

NF372-TB Soldering Flux

NF372-TB Soldering Flux Kester NF372-TB is a zero-halogen, no-clean, low solids liquid flux designed to withstand long dwell times and high preheat temperatures needed in thick board assemblies. Sustained activity within the flux allows for good barrel fill in challenging applications, such as reflowed copper OSP boards or with difficult to solder components. NF372-TB residues are minimal, clear and non-tacky for improved cosmetics. NF372-TB is classified as ROL0 flux under IPC J-STD-004B.

Specifikace (EN)  pdf

NF372-TB

4662 Flux Thinner

4662 Flux Thinner Kester 4662 Flux Thinner is used for reducing solids or replacing evaporated solvent, resulting in maximum efficiency of the flux. To select a thinner, use the process compatibility information or contact Kester Technical Support.

4662

TSF-6522RH

TSF-6522RH Kester TSF-6522RH is a rosin based, no-clean tacky soldering flux formula designed to be compliant with IEC 61249-2-21 definition for halide-free materials. TSF-6522RH is a formula being marketed for customers familiar with Kester\\\’s TSF-6522 formula, but now must comply with new halide-free legislation. TSF-6522RH can be used with a doctor blade or a drum fluxer. TSF-6522RH can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages.

Specifikace (EN)  pdf

TSF-6522RH

TSF-6852

TSF-6852 Kester TSF-6852 is a synthetic water-soluble tacky soldering flux. The synthetic ingredients eliminate naturally occurring raw materials typically found in fluxes. This maximizes lot-to-lot consistency. TSF-6852 is room temperature stable and does not require refrigeration for long-term storage. This reduces production line space for material storage and the cost of refrigerated storage. TSF-6852 has been formulated to be a drop in replacement for a variety of metallurgies. These include low melting point alloys (SnBi, SnBiAg, etc.), typical tin-lead eutectic alloys and the higher melting point, lead-free alloys (SnAg, SnCu, SnAgCu, SnSb, etc.). Post reflow, the residues are completely soluble in water and do not require any cleaning additives. To reduce the cost of assembling, room temperature or cool water (<65ºC) can be used to remove TSF-6852 residues.

Specifikace (EN)  pdf

TSF-6852